JPH028381Y2 - - Google Patents
Info
- Publication number
- JPH028381Y2 JPH028381Y2 JP8998287U JP8998287U JPH028381Y2 JP H028381 Y2 JPH028381 Y2 JP H028381Y2 JP 8998287 U JP8998287 U JP 8998287U JP 8998287 U JP8998287 U JP 8998287U JP H028381 Y2 JPH028381 Y2 JP H028381Y2
- Authority
- JP
- Japan
- Prior art keywords
- sleeve
- electric wire
- synthetic resin
- covering
- wire connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 229920003002 synthetic resin Polymers 0.000 claims description 15
- 239000000057 synthetic resin Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 6
- 239000004677 Nylon Substances 0.000 claims description 4
- 229920001778 nylon Polymers 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 239000004800 polyvinyl chloride Substances 0.000 claims description 4
- 238000002788 crimping Methods 0.000 claims description 3
- 229920001903 high density polyethylene Polymers 0.000 claims description 3
- 239000004700 high-density polyethylene Substances 0.000 claims description 3
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims 1
- -1 polyethylene Polymers 0.000 claims 1
- 229920000573 polyethylene Polymers 0.000 claims 1
- 239000010410 layer Substances 0.000 description 8
- 239000012943 hotmelt Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8998287U JPH028381Y2 (en]) | 1987-06-11 | 1987-06-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8998287U JPH028381Y2 (en]) | 1987-06-11 | 1987-06-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63198175U JPS63198175U (en]) | 1988-12-20 |
| JPH028381Y2 true JPH028381Y2 (en]) | 1990-02-28 |
Family
ID=30949455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8998287U Expired JPH028381Y2 (en]) | 1987-06-11 | 1987-06-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028381Y2 (en]) |
-
1987
- 1987-06-11 JP JP8998287U patent/JPH028381Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63198175U (en]) | 1988-12-20 |
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